Infineon Technologies AG has recently introduced an innovative packaging technology that will bring greater current carrying capacity and higher efficiency to demanding automotive electronics applications such as pure electric vehicles and hybrid vehicles.
According to reports, the newly introduced TO package complies with the JEDEC standard H-PSOF (heat-dissipating plastic small-profile flat lead). It helps automotive system designers achieve higher mandatory automotive fuel efficiency standards while meeting stringent overall emissions requirements. To meet these standards, power MOSFETs with a current capability of more than 200 amps and an on-resistance of less than 1 milliohm must be used to reduce transmission losses and improve overall efficiency. To date, the automotive market has not yet introduced MOSFETs that meet these requirements.
In addition, the H-PSOF package is smaller in size and height than the standard D2PAK package (TO-263) commonly used in automotive applications of the same type. The area of ​​the H-PSOF package is about 20% smaller than the current D2PAK, and the height is almost half that of the D2PAK.
It is reported that the first products launched by Infineon in the H-PSOF package technology are 40V OptiMOS T2 power transistors. Their drain currents are as high as 300 amps and on-resistance as low as 0.76 milliohms.
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